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What is IPC-1752?
IPC
is short for
"Institute
for Printed Circuits", a
global trade association serving the printed circuit board and
electronics assembly industries.
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In February
2010, IPC issued a new suite of declaration standards, known collectively as IPC-175X Schema Version
2.0: |
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IPC-1751: Generic
Declaration (required for all declarations) |
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IPC-1752: Materials
Declaration Management |
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IPC-1756: Manufacturing
Process Data Management |
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Additional standards in the suite will be released at a later
date: |
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IPC-1753: Laminate
Structure Declaration Mgmt (replaces IPC-1730) |
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IPC-1754: Printed Board
Declaration Management (replaces IPC-1710) |
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IPC-1755: Electronic
Assembly Declaration Mgmt (replaces IPC-1720) |
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IPC-1758: Declaration of
Shipping, Packing & Packaging Materials |
Free downloads are
available at
www.ipc.org
after you register with the IPC.
The new standards
are designed to be implemented with third party
software tools (the old, unwieldy 1752-1 and 1752-2 PDF forms are
no more). The required data format is based upon an Extensible Markup
Language (XML) schema and a Unified
Modeling Language (UML) model. The intent is to facilitate the automated
electronic exchange of data between members of the supply chain.
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Highlights of
Generic Requirements (IPC-1751A) |
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Requestor
information: mandatory for request/reply mode ("pull") but not
for "push" distribution; company name and contact name, phone
and email are required |
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Product
information: "product object" may refer to a product or group of
products; info may be broken down by "subproduct" and include
product version or manufacturing site; the manufacturer product
number, product mass, unit of measure and unit type are
mandatory |
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Supplier
information: mandatory items include company name and date;
name, phone and email of contact person; name, phone and email
of authorized representative (person responsible for declaration) |
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Legal
statement, digital signature and attached files are optional |
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There are
four classes of Materials
Declaration (which may be combined) |
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Class A
query/response: supplier provides true/false responses to
predetermined compliance statements |
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Class B
material group: supplier provides total mass for each "material
group" as defined by IEC project 62474 (standard is still in development
with
projected release November 2011) |
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Class C product
level: supplier provides mass of JIG-101 substances when above
threshold level (includes RoHS substances and REACH SVHCs) |
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Class D
homogeneous material: supplier lists homogeneous
materials in product and provides mass of JIG-101 substances
for each homogeneous material |
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Highlights of
Materials Declaration (IPC-1752A) |
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True/false
query response: product does/does not contain substances above
the thresholds listed in JIG-101 (full list) or REACH
SVHCs listed in JIG-101 or REACH SVHCs not listed
in JIG-101 (because they aren't used in electrotechnical products) |
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RoHS query
responses: product meets RoHS requirements, meets RoHS
requirements with selected exemption, lead in solder may qualify
under exemption 7b (supplier use only), does not meet RoHS
requirements or no information available for obsolete
product |
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Threshold
levels are reported as a percentage of mass (mass%) and must be
converted from ppm in JIG-101 (1000 ppm = 0.1%)
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RoHS product
level declarations: report worst-case concentration of substance
in a homogeneous material, location of substance, and any RoHS
exemption that applies |
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Homogeneous
material declaration: report mass of JIG-101 substances,
mass of
homogeneous materials in which they are found, and mass of product;
report CAS numbers and RoHS exemptions |
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Custom queries
and declaration substances may be added; attachments are
supported |
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Highlights of
Manufacturing Process Data (IPC-1756) |
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Used to report
sensitivity of components to solder temperature or moisture;
metric units of measurement only (Celsius) |
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Package configuration per Table
4-1 |
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Moisture sensitivity level (MSL)
rating per J-STD-020 (i.e. maximum time of exposure to 30o
temp at 60% relative humidity) |
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Package attributes: classification
temperature, maximum time at temperature, heating rate
limitation (maximum degrees per second), maximum preheat
temperature, maximum time in preheat, maximum component
temperature spike, maximum time above 217o, cooling
rate limitation (maximum degrees per second) |
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Soldering parameters: maximum
number of solder processing cycles, maximum wave solder
temperature and maximum time in wave |
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Terminals: terminal shape per
Table 4-4; minimum size and shape of metallic land pattern
for proper attachment; number of terminations; terminal base
material per Table 4-5; terminal plating finish material
per Table 4-6; bulk solder termination material per
Table 4-7 |
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Process sensitivity level (PSL)
rating per J-STD-075 (i.e. W0 to W9 for wave solder; R0
to R9 for reflow soldering) plus letter to indicate process
limitations per Table 4-8 |
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Comments:
manufacturing data not included in table options (NAC not
applicable comment); tin whisker mitigation techniques |
This
summary is intended to give you an easy-to-understand overview and does
not constitute legal advice. The actual standard in the original
language should be reviewed and used for all business, legal, and
product compliance purposes.
Should you need assistance
in implementing or managing a database solution for IPC-175X schema, we stand ready to help you. Just
email
us or give us a call at 972-679-8996 for a rapid and personalized
response.
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