What is IPC-1752?

IPC is short for "Institute for Printed Circuits", a global trade association serving the printed circuit board and electronics assembly industries.

In February 2010, IPC issued a new suite of declaration standards, known collectively as IPC-175X Schema Version 2.0:
	IPC-1751: Generic Declaration (required for all declarations)
	IPC-1752: Materials Declaration Management
	IPC-1756: Manufacturing Process Data Management
Additional standards in the suite will be released at a later date:
	IPC-1753: Laminate Structure Declaration Mgmt (replaces IPC-1730)
	IPC-1754: Printed Board Declaration Management (replaces IPC-1710)
	IPC-1755: Electronic Assembly Declaration Mgmt (replaces IPC-1720)
	IPC-1758: Declaration of Shipping, Packing & Packaging Materials
Free downloads are available at www.ipc.org after you register with the IPC.

The new standards are designed to be implemented with third party software tools (the old, unwieldy 1752-1 and 1752-2 PDF forms are no more). The required data format is based upon an Extensible Markup Language (XML) schema and a Unified Modeling Language (UML) model. The intent is to facilitate the automated electronic exchange of data between members of the supply chain.

Highlights of Generic Requirements (IPC-1751A)
	Requestor information: mandatory for request/reply mode ("pull") but not for "push" distribution; company name and contact name, phone and email are required
	Product information: "product object" may refer to a product or group of products; info may be broken down by "subproduct" and include product version or manufacturing site; the manufacturer product number, product mass, unit of measure and unit type are mandatory
	Supplier information: mandatory items include company name and date; name, phone and email of contact person; name, phone and email of authorized representative (person responsible for declaration)
	Legal statement, digital signature and attached files are optional
There are four classes of Materials Declaration (which may be combined)
	Class A query/response: supplier provides true/false responses to predetermined compliance statements
	Class B material group: supplier provides total mass for each "material group" as defined by IEC project 62474 (standard is still in development with projected release November 2011)
	Class C product level: supplier provides mass of JIG-101 substances when above threshold level (includes RoHS substances and REACH SVHCs)
	Class D homogeneous material: supplier lists homogeneous materials in product and provides mass of JIG-101 substances for each homogeneous material

Highlights of Materials Declaration (IPC-1752A)
	True/false query response: product does/does not contain substances above the thresholds listed in JIG-101 (full list) or REACH SVHCs listed in JIG-101 or REACH SVHCs not listed in JIG-101 (because they aren't used in electrotechnical products)
	RoHS query responses: product meets RoHS requirements, meets RoHS requirements with selected exemption, lead in solder may qualify under  exemption 7b (supplier use only), does not meet RoHS requirements or no information available for obsolete product
	Threshold levels are reported as a percentage of mass (mass%) and must be converted from ppm in JIG-101 (1000 ppm = 0.1%)
	RoHS product level declarations: report worst-case concentration of substance in a homogeneous material, location of substance, and any RoHS exemption that applies
	Homogeneous material declaration: report mass of JIG-101 substances, mass of homogeneous materials in which they are found, and mass of product; report CAS numbers and RoHS exemptions
	Custom queries and declaration substances may be added; attachments are supported

Highlights of Manufacturing Process Data (IPC-1756)
	Used to report sensitivity of components to solder temperature or moisture; metric units of measurement only (Celsius)
	Package configuration per Table 4-1
	Moisture sensitivity level (MSL) rating per J-STD-020 (i.e. maximum time of exposure to 30o temp at 60% relative humidity)
	Package attributes: classification temperature, maximum time at temperature, heating rate limitation (maximum degrees per second), maximum preheat temperature, maximum time in preheat, maximum component temperature spike, maximum time above 217o, cooling rate limitation (maximum degrees per second)
	Soldering parameters: maximum number of solder processing cycles, maximum wave solder temperature and maximum time in wave
	Terminals: terminal shape per Table 4-4; minimum size and shape of metallic land pattern for proper attachment; number of terminations; terminal base material per Table 4-5; terminal plating finish material per Table 4-6; bulk solder termination material per Table 4-7
	Process sensitivity level (PSL) rating per J-STD-075 (i.e. W0 to W9 for wave solder; R0 to R9 for reflow soldering) plus letter to indicate process limitations per Table 4-8
	Comments: manufacturing data not included in table options (NAC not applicable comment); tin whisker mitigation techniques

This summary of the IPC-1752 is designed to provide you with an accurate, easy-to-understand overview of the topic and does not constitute legal advice. The actual standard in the original language should be reviewed and used for all business, legal, and product compliance purposes.

RSJ excels at helping you collect and report the data about what is in your products. Once you have the underlying data about your products in place, it can be analyzed against any standard or regulation worldwide. We are here to help you!
 

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