|
1
|
Mercury in single capped (compact) fluorescent lamps
not exceeding: |
|
1a
|
For general lighting purposes < 30 W: 5 mg per burner.
Expired December
31,
2011
After December
31,
2011:
3.5 mg per burner
After December
31,
2012: 2.5 mg per burner
|
|
1b
|
For general lighting purposes ≥ 30 W and < 50 W: 5 mg per
burner
Expired December
31,
2011
After December
31,
2011:
3.5 mg per burner
|
|
1c
|
For general lighting purposes ≥ 50 W and < 150 W: 5 mg per
burner |
|
1d
|
For general lighting purposes ≥ 150 W: 15 mg per burner |
|
1e
|
For general lighting purposes with circular or square structural
shape and tube diameter ≤ 17 mm. No limit until
2012
After December
31,
2011:
7 mg per burner
|
|
1f
|
For special purposes: 5 mg per burner |
|
2a
|
Mercury in double-capped linear fluorescent lamps for
general lighting purposes not exceeding: |
|
2a1 |
Tri-band phosphor with normal lifetime and a tube diameter < 9 mm (T2):
5 mg per lamp.
Expired December 31, 2011
After December 31, 2011: 4 mg per lamp
|
|
2a2 |
Tri-band phosphor with normal lifetime and a tube diameter ≥ 9 mm
and ≤ 17 mm (T5): 5 mg per lamp. Expired December 31, 2011
After December 31, 2011: 3 mg per lamp
|
|
2a3 |
Tri-band phosphor with normal lifetime and a tube diameter > 17 mm
and ≤ 28 mm (T8): 5 mg per lamp. Expired December 31, 2011
After December 31, 2011: 3.5 mg per lamp
|
|
2a4 |
Tri-band phosphor with normal lifetime and a tube diameter > 28 mm
(T12): 5 mg per lamp. Expires on December 31, 2012
After December 31, 2012: 3.5 mg per lamp
|
|
2a5 |
Tri-band phosphor with long lifetime (≥ 25 000 h): 8 mg
per lamp
Expired December 31, 2011. After December 31, 2011: 5 mg per lamp
|
|
2b |
Mercury in other fluorescent lamps not exceeding: |
|
2b1 |
Linear halophosphate lamps with tube > 28 mm (T10 and T12):
10 mg per lamp Expires on April 13, 2012 |
|
2b2 |
Non-linear halophosphate lamps (all diameters): 15 mg per lamp
Expires on April 13, 2016 |
|
2b3 |
Non-linear tri-band phosphor lamps with tube diameter > 17 mm
(T9)
No limit until 2012. After December 31, 2011: 15 mg per lamp
|
|
2b4 |
Lamps for other general lighting and special purposes (induction
lamps)
No limit until 2012. After December 31, 2011: 15 mg per lamp
|
|
3 |
Mercury in cold cathode fluorescent lamps and external
electrode fluorescent lamps (CCFL and EEFL) for special purposes not
exceeding: |
|
3a |
Short length (≤ 500 mm). No limit until 2012
After December 31, 2011: 3.5 mg per lamp
|
|
3b
|
Medium length (> 500 mm and ≤ 1,500 mm).
No limit until
2012
After December
31,
2011:
5 mg per lamp
|
|
3c |
Long length (> 1 500 mm). No limit until 2012
After December 31, 2011: 13 mg per lamp
|
|
4a
|
Mercury in other low pressure discharge lamps.
No limit until 2012.
After December 31, 2011: 15 mg per lamp
|
|
4b
|
Mercury in high pressure sodium (vapor) lamps for
general lighting purposes in lamps with improved color rendering
index Ra > 60
not exceeding: |
|
4b-I
|
P ≤ 155 W. No limit until 2012. After December 31, 2011: 30 mg per burner
|
|
4b-II
|
155 W < P ≤ 405 W. No limit until 2012
After December 31, 2011: 40 mg per burner
|
|
4b-III |
P > 405 W. No limit until 2012. After December 31, 2011: 40 mg per burner
|
|
4c
|
Mercury in other high pressure sodium (vapor) lamps
for general lighting purposes not exceeding: |
|
4c-I
|
P ≤ 155 W. No limit until 2012. After December 31, 2011: 25 mg per burner
|
|
4c-II
|
155 W < P ≤ 405 W. No limit until 2012.
After December 31, 2011: 30 mg per burner
|
|
4c-III
|
P > 405 W. No limit until 2012. After December 31, 2011: 40 mg per burner
|
|
4d
|
Mercury in high pressure mercury (vapor) lamps (HPMV)
Expires on April 13, 2015 |
|
4e |
Mercury in metal halide lamps (MH) |
|
4f |
Mercury in other discharge lamps for special purposes
not specifically mentioned in this Annex |
|
5a |
Lead
in glass of cathode ray tubes |
|
5b |
Lead
in glass of fluorescent tubes not exceeding 0.2 % by weight |
|
6a |
Lead
as an alloying element in steel for machining purposes and in
galvanized steel containing up to 0.35 % lead by weight |
|
6b |
Lead
as an alloying element in aluminum containing up to 0.4 % lead by
weight |
|
6c |
Copper alloy
containing up to 4 %
Lead by weight |
|
7a |
Lead
in high melting temperature type solders (lead-based alloys
containing 85 % by weight or more lead) |
|
7b |
Lead
in solders for servers, storage and storage array systems, network
infrastructure equipment for switching, signaling, transmission, and
network management for telecommunications |
|
7c-I
|
Electrical and electronic components containing
lead
in a glass or ceramic other than dielectric ceramic in capacitors (piezoelectronic
devices) or in a glass or ceramic matrix compound |
|
7c-II
|
Lead
in dielectric ceramic in capacitors for a rated voltage of 125 V AC
or 250 V DC or higher |
|
7c-III
|
Lead
in dielectric ceramic in capacitors for a rated voltage of less than
125 V AC or 250 V DC. Expires on January 1, 2013
(except spare parts for EEE placed on market before Jan 1, 2013) |
7c-IV
new |
Lead
in PZT-based dielectric ceramic materials for capacitors being part
of integrated circuits or discrete semiconductors |
|
8a |
Cadmium and its compounds in one shot pellet type
thermal cut-offs
Expired January 1, 2012
(except spare parts for EEE placed on market before Jan 1, 2012) |
|
8b |
Cadmium and its compounds in electrical contacts |
|
9 |
Hexavalent
chromium as an anticorrosion
agent of the carbon steel cooling system in absorption refrigerators
up to 0.75 % by weight in the cooling solution |
|
9b |
Lead
in bearing shells and bushes for refrigerant-containing compressors
for heating, ventilation, air conditioning and refrigeration (HVACR)
applications |
|
11a |
Lead
used in C-press compliant pin connector systems
Expired September 24, 2010
(except spare parts for EEE placed on market before Sept 24, 2010) |
|
11b |
Lead
used in other than C-press compliant pin connector systems
Expires on January 1, 2013
(except spare parts for EEE placed on market before Jan 1, 2013) |
|
12
|
Lead
as a coating material for the thermal conduction module C-ring
Expired September 24, 2010
(except spare parts for EEE placed on market before Sept 24, 2010) |
|
13a |
Lead
in white glasses used for optical applications |
|
13b |
Cadmium and
lead in filter glasses and
glasses used for reflectance standards |
|
14 |
Lead in
solders consisting of more than two elements for the connection between pins and package of microprocessors
with lead content of more than 80% and less than 85% by weight.
Expired January
1,
2011
(except spare parts for EEE placed on market before Jan
1, 2011) |
|
15
|
Lead in
solders to complete a viable electrical connection
between semiconductor die and carrier
within integrated circuit flip chip packages
|
|
16
|
Lead in linear
incandescent lamps with silicate coated tubes
Expires on September
1,
2013 |
|
17 |
Lead halide as radiant agent in
high intensity discharge (HID) lamps
used for professional reprography applications |
|
18a
|
Lead
as activator in the fluorescent powder (1 % lead by
weight or less) of discharge lamps when used as specialty lamps for
diazoprinting reprography, lithography, insect traps, photochemical
and curing processes containing phosphors such as SMS. Expired January
1,
2011 |
|
18b
|
Lead
as activator in the fluorescent powder (1 % lead by weight or less)
of discharge lamps when used as sun tanning lamps containing
phosphors such as BSP |
|
19 |
Lead with PbBiSn-Hg
and PbInSn-Hg in specific compositions as main amalgam and
with PbSn-Hg as auxiliary amalgam in very compact energy saving lamps (ESL).
Expired June
1,
2011 |
|
20 |
Lead
oxide in
glass used for bonding front & rear substrates of flat fluorescent lamps
used for liquid crystal displays (LCD).
Expired June
1,
2011 |
|
21 |
Lead
and
cadmium in printing
inks
for the application of enamels on glasses, such as borosilicate and soda
lime glasses |
|
23 |
Lead in finishes of fine pitch
components other than connectors
with a pitch of 0.65 mm and less. Expired September 24, 2010
(except spare parts for EEE placed on market before Sept 24, 2010) |
|
24 |
Lead in solders for the
soldering to
machined through hole discoidal or planar array
ceramic multilayer capacitors |
|
25 |
Lead
oxide in surface conduction electron emitter displays (SED) used in
structural elements, notably in the seal frit and frit ring |
|
26 |
Lead oxide in the glass envelope
of black light blue lamps
Expired June 1, 2011 |
|
27 |
Lead alloys as solder for transducers
used in high-powered loudspeakers
designated to operate for several hours at acoustic power levels of 125 dB SPL
and above. Expired September 24, 2010 |
|
29
|
Lead bound in crystal glass
as defined in Annex I (Categories 1, 2, 3, 4) of Directive 69/493/EEC |
|
30 |
Cadmium alloys as electrical/mechanical solder joints
to electrical conductors located directly on the voice coil
in transducers used in high-powered loudspeakers with sound pressure
levels of 100 dB (A) and more |
|
31 |
Lead in soldering materials in mercury free flat
fluorescent lamps (used for liquid crystal displays, design or
industrial lighting) |
|
32 |
Lead oxide in seal frit used for making window assemblies
for Argon and Krypton laser tubes |
|
33 |
Lead in solders for the soldering of thin
copper wires
of 100 µm diameter and less in power transformers |
|
34 |
Lead in cermet-based trimmer potentiometer
elements |
|
36 |
Mercury used as a cathode sputtering
inhibitor
in DC plasma displays with a content up to 30 mg per display. Expired July 1, 2010 |
|
37 |
Lead in the plating layer of high voltage
diodes
on the basis of a zinc borate glass body |
|
38 |
Cadmium and
cadmium oxide in thick film pastes
used on aluminum bonded beryllium oxide |
|
39 |
Cadmium
in color converting II-VI LEDs (< 10 μg Cd per mm2 of
light-emitting area) for use in solid state illumination or display
systems
Expires on July 1, 2014 |
40
new |
Cadmium
in photoresistors for analogue optocouplers applied in professional
audio equipment. Expires on Dec 31, 2013 |
