|
1
|
Mercury in
compact fluorescent lamps:
not exceeding 5 mg per lamp
|
|
2
|
Mercury in
straight fluorescent lamps for general purposes
not exceeding 10 mg halophosphate
not exceeding 5 mg triphosphate (normal lifetime)
not exceeding 8 mg triphosphate (long lifetime)
|
|
3
|
Mercury in
straight fluorescent lamps for special purposes
|
|
4
|
Mercury in
other lamps not specifically mentioned in this Annex
|
|
5 |
Lead in glass
of cathode ray tubes, electronic components & fluorescent tubes.
|
|
6 |
Lead as an
alloying element:
in steel containing up to 0.35% lead by weight
in aluminium containing up to 0.4% lead by weight
in copper containing up to 4% lead by weight
|
|
7a |
Lead in high
melting temperature type solders
(lead-based alloys containing 85% by weight or more lead) |
|
7b |
Lead in
solders
for servers, storage and storage array systems
for telecommunications network infrastructure equipment
(switching, signaling, transmission, network management) |
|
7c
|
Lead in
electronic ceramic parts
(piezoelectronic devices)
|
|
8 |
Cadmium/compounds in electrical contacts
and cadmium plating
except for applications banned under Directive 91/338/EEC
relating to restrictions on the marketing and use of
certain dangerous substances and preparations |
|
9 |
Hexavalent
chromium as an anti-corrosion
of the carbon steel cooling system in absorption refrigerators |
|
9a |
DecaBDE
in
polymeric applications
Exemption ended July
1, 2008
|
|
9b |
Lead
in
lead-bronze bearing shells and bushes
|
|
10 |
Light
bulbs
(being investigated) |
|
11
|
Lead used in
compliant pin connector systems
|
|
12 |
Lead
as a coating material
for the thermal conduction module c-ring
|
|
13 |
Lead and cadmium
in optical and filter glass |
|
14 |
Lead in
solders consisting of more than two elements
for the connection between pins and package of microprocessors
with lead content of more than 80% and less than 85% by weight
|
|
15
|
Lead in
solders to complete a viable electrical connection
between semiconductor die and carrier
within integrated circuit Flip Chip packages
|
|
16
|
Lead in linear
incandescent lamps with silicate coated tubes
|
|
17 |
Lead halide as radiant agent
in High Intensity Discharge (HID) lamps
used for professional reprography
|
|
18a
|
Lead as an
activator in the fluorescent powder
(1% lead by weight or less)
of discharge lamps containing phosphors such as BSP
used for sun tanning lamps
|
|
18b
|
Lead
as an
activator in the fluorescent powder
(1% lead by weight or less)
of specialty lamps containing phosphors such as SMS
used for diazo-printing reprography, lithography, photochemical
processes, curing processes, and insect traps |
|
19 |
Lead
with PbBiSn-Hg in specific compositions as main amalgam
with PbInSn-Hg in specific compositions as main amalgam
with PbSn-Hg as auxiliary amalgam
used in very compact Energy Saving Lamps (ESL)
|
|
20 |
Lead oxide in
glass
used for bonding front & rear substrates of flat fluorescent lamps
in Liquid Crystal Displays (LCD)
|
|
21 |
Lead and
cadmium in printing
inks
for the application of enamels on borosilicate glass
|
|
22 |
Lead
as impurity in RIG (rare earth iron garnet) Faraday rotators
used for fibre optic communications systems
until December 31, 2009 (exemption expires) |
|
23 |
Lead in finishes of fine pitch
components other than connectors
with a pitch of 0.65 mm or less
with NiFe lead frames
or copper lead frames |
|
24 |
Lead in solders for the
soldering to
machined through hole discoidal or planar array
ceramic multilayer capacitors |
|
25 |
Lead oxide in plasma display panels (PDP)
or surface conduction electron emitter displays (SED)
used in structural elements
(front & rear glass dielectric layer, bus electrode, black stripe, address electrode, barrier ribs, seal frit
& frit
ring)
and in print pastes
|
|
26 |
Lead oxide in the glass envelope
of black light blue (BLB) lamps |
|
27 |
Lead alloys as solder for transducers
used in high-powered loud speakers
(operate at acoustic power levels of 125 dB SPL & above)
|
|
28
|
Hexavalent chromium in
corrosive preventive coatings
of unpainted metal sheetings and fasteners used for
corrosion protection and electromagnetic interference shielding
in IT and telecommunications equipment
(exemption expired July 1, 2007)
|
|
29
|
Lead bound in crystal glass
Categories 1, 2, 3 and 4 of Directive 69/493/EEC |
|
30 |
Cadmium
alloys as electrical/mechanical solder joints
to electrical conductors located directly on the voice coil
in tranducers used in high-powered loudspeakers (≥
100 dB) |
|
31 |
Lead
in soldering materials in mercury-free flat
fluorescent lamps (used for liquid crystal displays, design or
industrial lighting) |
|
32 |
Lead oxide
in seal frit used for making window assemblies
for Argon and Krypton laser tubes |
|
33 |
Lead in solders for the soldering of thin
copper wires
of 100 µm diameter and less in power transformers |
|
34 |
Lead in cermet-based trimmer potentiometer
elements |
|
35 |
Cadmium in photoresistors for optocouplers
applied in
professional audio equipment until December 31, 2009
(exemption expires) |
|
36 |
Mercury used as a cathode sputtering
inhibitor
in DC plasma displays with a content up to 30 mg per display
until July 1, 2010 (exemption expires) |
|
37 |
Lead in the plating layer of high voltage
diodes
on the basis of a zinc borate glass body |
|
38 |
Cadmium and
cadmium oxide in thick film pastes
used on aluminum bonded beryllium oxide |
